HomeNewsNew honors, new opportunities! Solidot was invited to attend the "2023 China Automation + Digitalization Industry Annual Conference" and received the Innovation Award.

New honors, new opportunities! Solidot was invited to attend the "2023 China Automation + Digitalization Industry Annual Conference" and received the Innovation Award.

2023-04-24

Recently, the "2023 China Automation + Digitalization Industry Annual Conference" hosted by the China Industrial Control Network was held in Suzhou. The conference, themed "Embracing Digital Intelligence, Propelling New Industry," showcased outstanding achievements in the digital upgrade of the industry and explored pathways for industrial development. Solidot, as a representative of domestic I/O enterprises, was invited to attend and presented digital products and solutions centered around industrial bus technology to numerous industry elites present.



At the conference, the results of the 21st Automation and Digitalization Annual Awards were announced, where Solidot's Slice I/O was recognized for its "strong scalability, complete functional modules, and stable and reliable performance," winning the Automation Innovation Award. It is well known that the distributed bus I/O sector has historically faced high industry barriers and low domestic penetration rates. However, with many foreign products being out of stock in recent years, domestic products have matured significantly. Solidot has capitalized on this trend with its specialized R&D achievements and high-quality service guarantees, emerging as a leader in the domestic distributed I/O industry. This award not only highlights Solidot's profound technological accumulation in the automation industry but also affirms its achievements in leading the digital transformation of the industry.




In addition to core products such as integrated I/O, Slice I/O, and valve islands, Solidot also showcased its new IP67 bus I/O and IO-Link bus I/O, aimed at creating a richer array of application scenarios and higher-quality solutions.


To meet the demands of complex industrial environments, the IP67 bus I/O shell is made from PBT + GF30% reinforced plastic material, and its fully sealed design enhances mechanical performance: the power interface uses M12-L coding, with a maximum overcurrent capacity of 16A, ensuring stable operation; the universal I/O and bus interfaces do not require custom cables and leave space for firmware upgrade interfaces for future compatibility; with a rich variety of I/O types supporting various signal types, it allows for flexibility and diversity in on-site applications.



In the field known as the last mile technology of automation, Solidot's IO-Link bus I/O is designed according to the IO-Link v1.1 standard and boasts an IP67 protection level. It offers optional Class-A or Class-B interface types and can connect to various IO-Link standard devices and standard switch signals, facilitating easier and quicker changes to parameter settings on-site, thus empowering Industry 4.0 comprehensively.



Despite the fluctuating pandemic over the past three years, Solidot has maintained rapid and high-quality development. In the future, Solidot will continue to adhere to the philosophy of "focus, professionalism, and specialization," launching more remote distributed I/O products centered around industrial interconnectivity scenarios. Through superior product quality, better delivery times, greater cost-effectiveness, and scaled procurement, Solidot aims to continuously deliver value to customers. Solidot looks forward to collaborating with more partners, harnessing collective strength, empowering innovation, and together heading towards a more intelligent and digital future.