SOLIDOT Launches PROFINET I/O Module with Key Advantages:
Compact Size: 102×72×25mm (L×W×H)
High Speed: ARM processor + dedicated ASIC chip
High Density: Up to 32 digital I/O points and 16 analog channels
Simplified cabling with daisy-chain topology
Scalable Flexibility: Extensive I/O variants for modular expansion
PROFINET integrated I/O is ideal for 3C electronics, new energy, logistics, packaging, printing, and beverage filling applications.