Solidot Made a Splendid Appearance at the 2025 Chengdu International Industrial Expo

On April 23, 2025, the Chengdu International Industrial Expo (hereinafter referred to as "the Expo") officially commenced, with Solidot making a remarkable appearance by showcasing its independently developed innovative products. During the event, Solidot attracted numerous industry professionals, enterprise representatives, and experts with its cutting-edge bus I/O technologies. On-site staff provided in-depth explanations of technical principles, application scenarios, and practical performance, offering attendees a comprehensive understanding of bus I/O solutions.

Image: Solidot Exhibition Booth

Deepening Technological Innovation: Pioneering New Standards for Domestic I/O Development

Highly Reliable Slice I/O Module – XB6S Series

The XB6S series supports multiple bus protocols and integrates motion control, temperature acquisition, and other functional modules. Rigorously tested for EMC compliance, it delivers exceptional interference resistance and stable connectivity. With diagnostic, alarm, and anomaly logging features, it ensures intelligent feedback and user-friendly operation.

Wiring-Saving Distributed I/O Module – XBF Series

The XBF series utilizes universal industrial Ethernet cables, eliminating the need for specialized wiring or tools to reduce costs. Available in diverse configurations and protection grades, it adapts to complex industrial environments. Expansion modules do not consume bus protocol node resources, enhancing system scalability and resource efficiency. Support for linear, star, and hybrid topologies ensures flexible system layouts.

Bus Valve Terminal Series

Solidot’s Bus Valve Terminal Series offers high versatility, seamlessly compatible with mainstream solenoid valves and multiple bus protocols. The aluminum alloy manifold enhances mechanical durability while meeting diverse industrial application demands.

Empowering Industries: Charting Intelligent Upgrades Across Sectors

Solidot’s bus I/O solutions empower enterprises to achieve intelligent production upgrades, with applications spanning 3C electronics, automotive manufacturing, new energy, and logistics warehousing. At the Expo, Solidot’s sales team tailored and demonstrated customized solutions by deeply analyzing customer needs and aligning them with industry-specific scenarios.

Looking ahead, Solidot will continue to advance bus I/O technologies, driven by market demands and technical breakthroughs. By exploring new application frontiers, the company aims to deliver even more efficient and intelligent bus I/O solutions for industrial automation.