Solidot concluded the 2026 Chengdu International Industrial Exposition with a perfect finish

From March 11 to 13, the 2026 Chengdu International Industrial Exposition (hereinafter referred to as “CIIF Chengdu”) was grandly held at the Western China International Expo City in Chengdu, under the theme “Building New Industrial Chains, Shaping a Low-Carbon Future.” Solidot made a strong appearance, showcasing its bus I/O solutions including Slice I/O, Discrete I/O, and IO-Link I/O.

Industry Hub, Drawing a New Blueprint for Intelligent Manufacturing in Western China

Solidot fully recognizes the strategic importance of the western region in the national landscape. Its participation in the expo was not only a showcase of cutting-edge products but also aimed to build an efficient bridge for communication, driving the regional application of advanced automation solutions. Through in-depth discussions with nearly a hundred clients and partners from industries such as automotive manufacturing, new energy, chemicals, and logistics, Solidot explored new pathways for automation transformation.

Highlight Showcase, Delivering New Bus I/O Solutions

At the expo, Solidot highlighted its high-reliability Slice I/O, wiring-saving Discrete I/O, and IO-Link bus I/O product lines, focusing on addressing current challenges in the bus I/O field regarding performance reliability and wiring economy.

The high-reliability Slice I/O module XB6S series supports multiple bus protocols and features functional modules such as motion control and temperature acquisition. These products undergo rigorous EMC testing, ensuring strong anti-interference and stable connectivity. They also support diagnostics, alarms, and abnormal event logging, enabling intelligent feedback for easy operation.

The Discrete I/O module XBF series uses standard industrial Ethernet cables, eliminating the need for special cables and tools, effectively reducing wiring costs. With products available in different form factors and protection ratings, they adapt to various complex industrial environments. Expansion modules do not consume bus protocol node resources, improving system scalability and resource utilization. The series supports daisy-chain, star, and hybrid topologies, offering greater flexibility in system layout.

Solidot’s IO-Link bus I/O modules are designed in compliance with the IO-Link v1.1.3 specification. They integrate power supply and data transmission, significantly simplifying wiring and improving deployment efficiency. Supporting mainstream bus protocols such as EtherCAT and PROFINET, these modules feature plug-and-play connectivity and intelligent diagnostics. They are widely used in industrial scenarios such as automotive manufacturing and logistics, enabling rapid device connection, efficient data transmission, and intelligent system management to enhance productivity.

Solidot gained valuable insights and established meaningful connections at the expo. Moving forward, the company will continue to deepen its expertise in the industrial bus I/O field, unlocking the potential for technological innovation, strengthening its R&D foundation, and fully supporting the leapfrog development of bus I/O products in intelligent manufacturing.