Solidot Debuts at the 25th China International Industry Fair

From September 23rd to 27th, 2025, the 25th China International Industry Fair was held at the National Convention and Exhibition Center in Shanghai. Solidot made a remarkable appearance, showcasing a range of innovative products that attracted numerous domestic and international professional visitors for in-depth discussions. Concurrently, during the event, Solidot collaborated with several leading industry enterprises to co-present a series of thematic speeches, focusing on innovative technologies and discussing cutting-edge trends in smart manufacturing alongside new opportunities for industrial collaboration.

[Image: Exhibition Site]

Spotlight on Innovative Products, Precisely Empowering Industry Efficiency

Solidot prominently featured its core product lines, including highly reliable Slice I/O, wiring-saving Distributed I/O, customizable Local I/O, and IO-Link Bus I/O. These offerings address key industry pain points within the bus I/O field, such as stable performance, wiring costs, and flexible production needs. Leveraging its innovative technology, Solidot launched multiple solutions tailored to practical scenarios. Through demonstrations simulating various topology requirements and actual wiring environments, the company effectively highlighted the advantages and characteristics of its bus I/O products.

[Image: Exhibition Site]

Collaborative Partner Showcase, Highlighting Synergistic Value

Throughout the exhibition, Solidot joined forces with several partner companies to deliver a series of thematic speeches under the theme "Empowering Industrial Interconnection, Co-creating the Future of Intelligent Manufacturing." These sessions focused on innovative collaboration and data-driven strategies, sparking widespread industry interest by exploring development opportunities in smart manufacturing. Additionally, Solidot's product expert team conducted multiple product introduction speeches. Using typical industry cases, they provided detailed analyses of the innovative designs and application capabilities of Solidot's Slice I/O, Distributed I/O, Local I/O, IO-Link Bus I/O, Distributed Network Components, Distributed Temperature Controllers, and Distributed Stepper Drives.

[Partner Company Display Board (Partial Content)]

[Partner Company Expert Speech]

[Solidot Product Team Speech]

Looking ahead, Solidot will continue to deepen the integration of product innovation and industry collaboration. By joining hands with its extensive network of partners, Solidot is committed to propelling smart manufacturing towards greater efficiency, openness, and intelligence, injecting powerful momentum into the global transformation of industrial intelligent manufacturing.