Application of Solidot's Slice Remote I/O Module XB6S in Semiconductor Dicing Machines

Semiconductor dicing machines are used to precisely cut wafers into individual chip units, requiring processes such as wafer separation, cutting trajectory control, cooling system monitoring, and packaging data recording. The equipment must simultaneously process micron-level motion commands and multiple types of signals, placing strict demands on real-time performance and interference immunity. The Shidian Technology remote I/O module XB6S series achieves high-speed coordinated control via the EtherCAT bus, ensuring a cutting accuracy of ±1 μm.

Shidian Technology products used in this case

XB6S-EC2002

XB6S-3200, XB6S-1600, XB6S-1616A, XB6S-0032A

XB6S-A40V, XB6S-A40TM, XB6S-PL20D

I. Production process introduction

Automated dicing process: wafer separation → cutting control → cooling monitoring → packaging recording

[Wafer separation]

A vacuum suction platform secures the wafer, and a robotic arm performs position calibration.

[Cutting control]

A high-speed spindle drives the grinding wheel along the cutting lane to achieve die separation.

[Cooling monitoring]

A flow meter encoder provides real-time feedback on coolant flow rate, while the temperature module simultaneously collects spindle and coolant temperatures.

[Packaging record]

After cutting is completed, the system automatically stores temperature, pressure, and flow data.

II. I/O Module Application Mode

The system uses an Advantech MIC-7700 industrial PC as the master, connecting multiple types of I/O modules via the EtherCAT coupler XB6S-EC2002. The industrial PC handles motion control algorithms, temperature PID regulation, and cutting logic operations, with modules deployed in groups by signal type—

Digital input module XB6S-3200/XB6S-1600: Collects signals from Limit Switches, vacuum pressure sensors, and safety doors

Digital output module XB6S-1616A/XB6S-0032A: Outputs Solenoid valve on/off control signals and cooling pump start/stop command signals

Analog voltage input module XB6S-A40V: Collects the analog voltage signal (0 ... 10 V) output by the spindle current sensor and the voltage signal output by the vibration sensor

Temperature Input Module XB6S-A40TM: Collects PT100 temperature sensor signals to monitor spindle/coolant dual-channel temperatures in real time

Incremental encoder counter module XB6S-PL20D: Receives AB-phase pulse signals from the flow meter's 5 V Differential encoder

Each module focuses on signal acquisition and execution control, working together with the industrial PC to ensure high real-time performance and stability of the cutting system.

III. Solution optimization results

Compared with the customer's original integrated and Slice I/O solutions from other brands, the XB6S series simplifies the wiring architecture through modular integration, reducing overall maintenance costs while maintaining the same cutting accuracy. With multiple types of modules working together, its anti-interference design effectively ensures system stability in high-frequency electromagnetic environments, significantly improving equipment operational reliability.

IV. High-reliability remote I/O module XB6S series

Shidian Technology's remote I/O module XB6S series is compatible with multiple Bus protocols and includes Function Modules such as motion control and temperature acquisition. The products have passed rigorous EMC testing, offering exceptional anti-interference performance and reliable connectivity without disconnection. They support Diagnostics, alarm, and abnormal log recording with intelligent feedback, and are easy to use.