HomeApplication CasesSolidot Distributed I/O Module XBF Application in Semiconductor Chip Inspection Equipment

Solidot Distributed I/O Module XBF Application in Semiconductor Chip Inspection Equipment

Semiconductor

Semiconductor chip inspection demands high precision in signal acquisition, system flexibility, and stability. Solidot's distributed I/O XBF series reduces wiring complexity while enhancing maintainability and scalability, meeting production requirements in complex environments.

Products Used in This Case


XBF4-EC04, XBF2E-1600, XBF2E-0016A, XBF2E-0808A

 

1. Production Process Overview

Semiconductor inspection equipment involves: Wafer Loading → Development → Spin Coating → Defect Scanning → Sorting/Unloading.

  • Wafer Loading: Robotic arms transfer wafers; high-precision photoelectric sensors provide real-time positioning feedback.

  • Development: Optical sensors scan patterns; edge detection algorithms analyze line-width consistency.

  • Spin Coating: Dual-redundant monitoring via pressure transmitters/laser thickness gauges ensures uniform coating.

  • Defect Scanning: Multispectral imaging detects micron-level defects; data syncs to quality traceability platforms.

  • Sorting/Unloading: Pneumatic actuators sort good/defective products; robots unload via categorized paths.

2. I/O Module Implementation

Based on EtherCAT protocol, the system uses Beckhoff PLCs as the control core. The XBF4-EC04EtherCAT coupler builds a bus I/O system with:

  • 4 expansion ports (32 I/O modules max)

  • Supports linear/star/hybrid topologies

  • Distributed deployment of XBF2E series modules

Signal Handling:

XBF2E-1600: Photoelectric sensors (wafer positioning), limit switches (arm travel), safety door interlocks.


XBF2E-0808A: Magnetic cylinder switches (motion status), emergency stop signals.

XBF2E-0016A/XBF2E-0808A: Solenoid valves (sorting cylinders, coating valves), servo signals (conveyor control), alarm indicators.

3. Solution Benefits

Compared to legacy systems (Beckhoff PLC + local I/O + third-party hubs):
✔️ Cost Reduction: 30% lower cabling/accessory costs; eliminated hub procurement.
✔️ Efficiency Gain: 30% faster installation/maintenance with simplified wiring.
✔️ Enhanced Stability: Fewer nodes improve network reliability.

4. Cable-Saving Distributed I/O XBF Series

 

Standard industrial Ethernet cables (no special tools)
• Three-wire sensor power supply (eliminates terminal blocks)
• Flexible topologies: linear/star/hybrid
• Customizable points/structure/special functions