Solidot Remote I/O Module XB6S in Large-Sized Bonding Equipment Applications

Large-sized bonding equipment is a core asset in precision electronics manufacturing, responsible for mounting various components onto substrates. As panel sizes increase and yield requirements rise, these machines demand high positioning accuracy, multi-axis coordinated motion, and real-time process monitoring, placing stringent requirements on the communication real-time performance and stability of control systems. Implementing Solidot's Remote I/O Module XB6S series significantly reduces wiring complexity and ensures high-speed production.

Solidot Products Used in This Case:
XB6S-CB2002, XB6S-3200, XB6S-0032A, XB6S-PT04A

I. Production Process Overview

Intelligent Bonding Workflow: Substrate Positioning → Bonding Execution → Pressure Control → Defect Detection

• Substrate Positioning: Set bonding coordinates and pressure parameters; vision systems assist transfer mechanisms in precisely positioning substrates.

• Bonding Execution: Monitor bonding head position, motor speed, and pressure curve in real-time; perform closed-loop dynamic trajectory adjustments to prevent misalignment or component damage.

• Pressure Control: Precisely regulate bonding force and temperature to ensure uniform conductive adhesive curing, preventing cold soldering or substrate damage.

• Defect Detection: Identify flaws like weak/no bonds; trigger real-time alarms/reject defective products; log data for process optimization.

II. I/O Module Implementation

The system uses CC-Link IE Field Basic protocol. Solidot modules – digital input XB6S-3200, digital output XB6S-0032A, and 4-channel PTO pulse outputXB6S-PT04A– connect via coupler XB6S-CB2002 to Mitsubishi R32ENCPU PLCs.

XB6S-3200 collects critical signals: substrate presence sensors, safety door locks, and air pressure threshold alarms.

XB6S-0032A controls conveyor motors, vacuum valves, clamping cylinders, alarm lights, and cooling systems.

XB6S-PT04A executes PLC trajectory commands, outputting pulses to servo drives for high-precision X/Y/Z linear motion and rotational positioning of bonding heads.

These modules jointly ensure positional accuracy, closed-loop force control, and multi-axis synchronization for consistent large-panel bonding quality.

III. Solution Comparison

The legacy solution (relays + standard I/O) had critical flaws: pulse signal interference caused positioning drift during multi-axis motion; complex long-distance wiring increased troubleshooting time and limited scalability.
After adopting Solidot’s XB6S Remote I/O:

• Field wiring complexity reduced

• Pulse signal transmission stabilized

• Multi-axis positioning accuracy enhanced

• Pressure closed-loop response and synchronization improved

• Partial replacement of dedicated motion controllers lowered hardware costs.

IV. High-Reliability Remote I/O Module XB6S Series

Solidot's XB6S series supports multiple fieldbus protocols and integrates motion control/temperature acquisition modules. Certified by rigorous EMC tests, it delivers exceptional noise immunity and connection stability. Features include diagnostics, alarms, anomaly logging, and smart feedback for ease of use.